| PART |
Description |
Maker |
| SIO1007 |
LPC Super I/O LPC IrDA Hot Docking Chip with UART
|
Microchip Technology
|
| W39V040A W39V040AQ W39V040AP |
3.3-Volt Flash
NVM > Flash> FWH/LPC Flash Memory
512K 】 8 CMOS FLASH MEMORY WITH LPC INTERFACE
|
Winbond Electronics
WINBOND[Winbond]
|
| BAP64-05W115 BAP64-05W135 BAP64-05WT/R |
Silicon PIN diode BAP64-05W<SOT323 (SC-70)|<<http://www.nxp.com/packages/SOT323.html<1<week 30, 2003,;BAP64-05W<SOT323 (SC-70)|<<http://www.nxp.com/packages/SOT323.html<1<Always Pb-free,;
|
NXP Semiconductors N.V.
|
| LPC47M112-MW LPC47M112-MC |
ENHANCED SUPER I/O CONTROLLER WITH LPC INTERFACE MULTIFUNCTION PERIPHERAL, PQFP100
ENHANCED SUPER I/O CONTROLLER WITH LPC INTERFACE
|
SMSC, Corp.
SMSC Corporation
|
| KLCS-47E KMP47C1660F KMP47C1660N KMP47C1237N KMP47 |
4-BIT MICROCONTROLLERS 4位微控制
(KMP47C1xx) 4-BIT MICROCONTROLLERS
(KMP47C421 - KMP47C423) 4-BIT MICROCONTROLLERS
|
Korea Electronics (KEC)
KEC Holdings
KEC[KEC(Korea Electronics)]
http://
|
| W83697HF |
LPC I/O
|
Winbond
|
| W83697HF05 |
LPC I/O
|
Winbond
|
| W83627F-AW W83627G W83627G-AW W83627HG W83627HG-AW |
Winbond LPC I/O
|
Winbond
|
| W83L517D |
LPC SUPER I/O
|
WINBOND[Winbond]
|
| W83627HF W83627F W83627HF-AW |
Winbond LPC I/O
|
Winbond
|
| HEC4013BT HEF4013BT-T |
Dual D-type flip-flop HEC4013BT<SOT108-1 (SO14)|<<http://www.nxp.com/packages/SOT108-1.html<1<week 32, 2004,;HEC4013BT<SOT108-1 (SO14)|<<http://www.nxp.com/packages/SOT108-1.html<1<week 32, 2004,;HEF4013BP<SOT27-1
4000/14000/40000 SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14
|
NXP Semiconductors N.V.
|
| F85226AF |
LPC to ISA Bridge
|
Feature Integration Technology Inc.
|
